According to current mobile processors development, low voltage chips will have a TDP range of 17-25W and these Ultra-low voltage models in a BGA package will be thin enough for production of notebooks that are only 18mm thick. The new ultra-low voltage chips published from Intel also run at 17 watts worth of power and will likely be found underneath the next-generation Ultra-Book.
It becomes a clear fact that size is critical for mobile devices in next generation. A typical example such as Ultra-Book will need thinner heatpipes with excellent performance.
The slim heat pipe has advantages to both regular heat pipe and vapor chamber. It is bendable, be able to pressed and allows height difference setup. For the thickness, we can make it as thin as 1 mm.
The container material is copper, wick type is powdered sintering and working fluid is pure water. The wick structure is a combination of sintering copper powder wick and groove wick. The current range of thickness for this design is 1.2mm to 2.0mm.
The performance evaluation result of design 1 is as shown below:
(Mobile LV/ULV processor TDP standard is 17W)
The Thermal design power is 17W as given value from INTEL processor standard.
The container is made of pure copper, the wick is sintering copper powder and the working fluid is pure deionized water. Different from design 1, we have developed a structure where the wick only lines the inner wall of the heat pipe partly instead of lining the inner wall wholly. The current range of thickness for this design is 1 mm to 1.5 mm.
1mm (D6 * 150mm)
The figure shown above is our present thin flat heat pipe that was made from copper pipe of 6mm and with the length of 150mm, being compressed into 1mm of thickness. The wall thickness is 0.2mm.
The performance evaluation result of design 2 is as shown below: